April 23 - 25, 2014
ORGANIZED BY:Micromachine Center
Mitsubishi Heavy Industries will exhibit various panels showing the principles of room temperature bonding and the features of the Room Temperature Wafer Bonder.
A variety of wafer samples are also exhibited in our booth.
During this exhibition our research center engineers will attend the booth and explain our technology so that our customer would be able to use our technology for their research purpose or device manufacturing purposes.
Nano Micro Biz
The world's largest fair focusing on Micro/MEMS, Nano technologies & ROBOT technologies
|DATE & TIME||April 23 (Wednesday) - 25 (Friday), 2014
10:00 a.m. - 5:00 p.m.
Booth No. S-5
Access (Link to Pacifico Yokohama Website)
|ORGANIZED BY||Micromachine Center|
|ADMISSION FEE||JPY 2,000 (Free of charge with invitation card or pre-registration)
Please contact us for request invitation card.
Mitsubishi Heavy Industries, Ltd.
Sales Department Machine Tool Division
OF THE EXHIBITION