July 13 - 15, 2011
Tokyo Big Sight
ORGANIZED BY: Micromachine Center
We will exhibit
(1)A Wafer Bonding Machine by room temperature bonding
Rigid bonding is realized by SAB (Surface Activated Bonding) technology, which can be applied for MEMS packaging, LED, RF devices and Power device with its thermal stress free bonding and wide variety of bonding materials.
(2)Micro Milling machine μV1
We will exhibit wafers of hard material with micro machined patterns by micro milling, which enables photo masks less micro machining.
It will realize short lead-time low cost prototyping of microstructures.
|DATE & TIME||July 13 (Wed.) - 15 (Fri.), 2011, 10:00 a.m. - 5:00 p.m.|
|VENUE||Tokyo Big Sight, East Hall 2, D-10|
|ORGANIZED BY||Micromachine Center|
|ADMISSION FEE||1,000 yen per person (including tax)
Free Admission for invitation card holder