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Exhibition Micromachine / MEMS2011 (Dates [JST]: July 13 (Wed.) - 15 (Fri.), 2011)

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Exhibition Micromachine / MEMS2011

July 13 - 15, 2011
Tokyo Big Sight
ORGANIZED BY: Micromachine Center

OUTLINE OF OUR PRESENTATION

We will exhibit
(1)A Wafer Bonding Machine by room temperature bonding
Rigid bonding is realized by SAB (Surface Activated Bonding) technology, which can be applied for MEMS packaging, LED, RF devices and Power device with its thermal stress free bonding and wide variety of bonding materials.
(2)Micro Milling machine μV1
We will exhibit wafers of hard material with micro machined patterns by micro milling, which enables photo masks less micro machining.
It will realize short lead-time low cost prototyping of microstructures.

DATE & TIME July 13 (Wed.) - 15 (Fri.), 2011, 10:00 a.m. - 5:00 p.m.
VENUE Tokyo Big Sight, East Hall 2, D-10
ORGANIZED BY Micromachine Center
ADMISSION FEE 1,000 yen per person (including tax)
Free Admission for invitation card holder

EXHIBIT PRODUCTS

  • Wafer bonding machine
  • Micro milling machine μV1