December 3 - 5, 2014
Mitsubishi Heavy Industries, Ltd.
Tokyo Big Sight
Room Temperature Bonding has following features.
Mitsubishi Heavy Industries will demonstrate actual bonded wafers from 100mm to 300mm, Silicon, Compound semiconductor, Oxides, Metals.
|DATE & TIME||December 3 (Wednesday) - December 5 (Friday), 2014|
|VENUE||Tokyo Japan Tokyo Big Sight|
OF THE EXHIBITION
|Business contact||Machine Tool Division Sales Department
Click here to inquire