July 14 - 16, 2015
Suppose that two wafers are rigidly bonded at room temperature….such a dreamy idea is realized by SAB (Surface Activated Bonding)
SAB is originally developed in Japan and has been studied for a many years.
Today SAB technology becomes widely applied to various field, with thanks to its simple process and high degree of freedom in materials selection.
Our mission is to help customers in R&D and mass production of the devices.
BOND MEISTER is the wafer bonder worth the name of "MEISTER", which integrated manufacturing technology and process technology that Mitsubishi Heavy Industries has cultivated for many years.
Mitsubishi Heavy Industries will support our customers with reliable bonding machine and high quality bonding process services
|DATE & TIME||July 14 (Tuesday) - 16 (Thursday), 2015
10:00 a.m. - 5:00 p.m. (10:00 a.m. - 4:00 p.m. on Thursday 16)
|VENUE||San Francisco, USA
Moscone Center Booth #2232 in South Hall.
OF THE EXHIBITION